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Prototypes
Prototyping facilities
LACIME’s prototyping facilities cover different technologies including:
Standard PCB fabrication on different substrates such FR4 and several Rogers high frequency laminates (RT5870, RO3006, etc.) with plated through via holes using LPKF systems.
Machining of mechanical parts for circuit board housing
Advanced LTCC prototyping, thin film deposition and etching and MEMS prototyping
PCB fabrication and mechanical machining tools:
Fabrication facilities allow for single and double sided circuits with line widths and line spacing down to 10 mils (~250 microns). Housings are in aluminum can be up to 12”x12”x2”.
LTCC, thin film and MEMS fabrication facilty
LACIME’s LTCC and thin film/MEMS fabrications are carried out in its clean room facilities: a class 1000 and a class 10000.
The Class 1000 clean room for thin film and MEMS fabrication:
Plasma deposition: Plasmionique SPT-330H
Mask aligner: 800MBA from OAI
Wet bench with DI water generator: STC
Resin deposition system: Laurell WS-400BZ-6NPP/LITE
The Class 10,000 clean room for LTCC fabrication:
This clean room houses an industrial-grade LTCC process for prototyping as well low to medium volume production. It also houses our on-wafer testing system as well as various circuit inspection and assembly tools including a wire bonding station. The LTCC fabrication chain consists of the following machines (in the order of their use in the fabrication process):
Cutting machine: CM-15A, manufacturer: KEKO
It automatically cuts LTCC sheets using a guillotine with a heated support and blade. Although a file provides automatic cutting coordinates, cutting can also be done manually.
Printer: P200S, manufacturer: KEKO
It allows for imprinting via fills and conductor paths through silver or gold paste screen printing on LTCC substrate. A metal mask is used to fill the vias and a metal grillwork with photosensitive emulsion is used to trace conductor lines.
Perforator: PAM4s KEKO, manufacturer: KEKO
It mechanically perforates blank LTCC sheets using a punch. This machine accepts only a 12cm X 12cm sheet size. The working area is limited to 10cm X 10cm. There are two sizes available: 150 microns for all via fills and 3mm for alignment holes and also for fastening the plate to a control box after the manufacturing process is completed. An optical system ensures perforating point accuracy.
Automatic stacker: IS4PL KEKO, manufacturer: KEKO
It stacks and aligns LTCC sheets with each other. An optical system ensures alignment accuracy.
Isostatic press: ILS66S KEKO, manufacturer: KEKO
It laminates LTCC sheets after they have isostatically been stacked. The machine compresses water on LTCCs, which applies uniform pressure on all surfaces.
Cofiring: Isotemp 750 oven
Laminated LTCC layers are fired in this automated oven which follows a specific profile pre-programmed in its memory.
Assembly, inspection and testing
Sufrace profiling, wirebonding, soldering, and on-wafer probing are all available at LACIME.
Wire bonding: K&S 4522 ball bonder
This device makes electrical interconnections between substrates (ex. An integrated circuit and a package). A gold wire having a diameter of 25um is first welded to the first pad by forming a gold ball, then applying force and ultrasound (thermosonic). The second bond is done by applying thermosonic on the wire. The wire is cut by the same operation.
Surface profiler: Ambios XP-200