Prototypes

Prototyping facilities

LACIME’s prototyping facilities cover different technologies including:
  • Standard PCB fabrication on different substrates such FR4 and several Rogers high frequency laminates (RT5870, RO3006, etc.) with plated through via holes using LPKF systems.
  • Machining of mechanical parts for circuit board housing
  • Advanced LTCC prototyping, thin film deposition and etching and MEMS prototyping

PCB fabrication and mechanical machining tools:



Fabrication facilities allow for single and double sided circuits with line widths and line spacing down to 10 mils (~250 microns). Housings are in aluminum can be up to 12”x12”x2”.

LTCC, thin film and MEMS fabrication facilty

LACIME’s LTCC and thin film/MEMS fabrications are carried out in its clean room facilities: a class 1000 and a class 10000.


The Class 1000 clean room for thin film and MEMS fabrication:

Plasma deposition: Plasmionique SPT-330H




Mask aligner: 800MBA from OAI




Wet bench with DI water generator: STC




Resin deposition system: Laurell WS-400BZ-6NPP/LITE




The Class 10,000 clean room for LTCC fabrication:





This clean room houses an industrial-grade LTCC process for prototyping as well low to medium volume production. It also houses our on-wafer testing system as well as various circuit inspection and assembly tools including a wire bonding station. The LTCC fabrication chain consists of the following machines (in the order of their use in the fabrication process):

Cutting machine: CM-15A, manufacturer: KEKO

It automatically cuts LTCC sheets using a guillotine with a heated support and blade.  Although a file provides automatic cutting coordinates, cutting can also be done manually.















Printer: P200S, manufacturer: KEKO

It allows for imprinting via fills and conductor paths through silver or gold paste screen printing on LTCC substrate. A metal mask is used to fill the vias and a metal grillwork with photosensitive emulsion is used to trace conductor lines.











Perforator: PAM4s KEKO, manufacturer: KEKO

It mechanically perforates blank LTCC sheets using a punch. This machine accepts only a 12cm X 12cm sheet size. The working area is limited to 10cm X 10cm. There are two sizes available: 150 microns for all via fills and 3mm for alignment holes and also for fastening the plate to a control box after the manufacturing process is completed. An optical system ensures perforating point accuracy.










Automatic stacker: IS4PL KEKO, manufacturer: KEKO

It stacks and aligns LTCC sheets with each other. An optical system ensures alignment accuracy.











Isostatic press: ILS66S KEKO, manufacturer: KEKO 

It laminates LTCC sheets after they have isostatically been stacked. The machine compresses water on LTCCs, which applies uniform pressure on all surfaces.














Cofiring:  Isotemp 750 oven

Laminated LTCC layers are fired in this automated oven which follows a specific profile pre-programmed in its memory.










Assembly, inspection and testing

Sufrace profiling, wirebonding, soldering, and on-wafer probing are all available at LACIME.

Wire bonding:  K&S 4522 ball bonder

This device makes electrical interconnections between substrates (ex. An integrated circuit and a package). A gold wire having a diameter of 25um is first welded to the first pad by forming a gold ball, then applying force and ultrasound (thermosonic). The second bond is done by applying thermosonic on the wire. The wire is cut by the same operation.



Surface profiler: Ambios XP-200